抄録
In semiconductor pack aging used in automotive and infrastructure products, delamination occurring at the interface between metal components and molding resin is a significant reliability-related problem. This study verified the applicability of a prediction method that uses the ratio of fracture toughness value to fracture parameters as a delamination index. First, we fabricated joint specimens of Cu and molding resin, and evaluated the fracture toughness value for the roughness of Cu surface, the resin type, and the test temperature. Furthermore, using three-dimensional CAD models of two types of product shapes, we calculated the fracture parameters at the corner of Cu and molding resin by finite element method analysis. Finally, we compared the delamination state observed by SAT （Scanning Acoustic Tomography） with the delamination index, clarifying the applicability of the prediction method.
