抄録
Bonding materials for power device s are required to be high thermal and electrical conductivity without environmentally
hazardous substances. Electrically conductive adhesive （ECA） is a candidate of alternatives for high temperature Pb-included
solder. In the curing process of the suggested ECA, low-melting-point alloys such as Sn-3Ag-0.5Cu solder fillers are molten and
bridge between the copper main fillers to reduce the interfacial resistance. The wettability of the alloy on copper is important factor
for bridging. In this paper, Sn-58Bi alloy and Sn-3Ag-0.5Cu alloy are used in low-melting point alloy bridged conductive adhesives,
and the effects of Sn coating on the main Cu filler on thermal and electrical conductivity are evaluated focusing on wettability in the
resin.
