Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
Trends in Micro-joining Technology for Electronic Device Packaging
Shinji FUKUMOTO
Author information
Keywords: Micro-joining, Resin, Nano-particle, Solid-liquid Reaction, Surface Activated Bonding
JOURNAL FREE ACCESS

2014 Volume 3 Issue 1 Pages 35-39

Details
Download PDF (1357K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2014 Smart Processing Society for Materials, Environment & Energy
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top