Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
High Performance Thermal Insulators Developed by using Particle Bonding and its Application for Material Recycling
Akira KONDO, Hiroya ABE, Makio NAITO
Author information
Keywords: Particle Bonding, Thermal Insulator, Recycling, FRP
JOURNAL FREE ACCESS

2014 Volume 3 Issue 1 Pages 30-34

Details
Download PDF (1122K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2014 Smart Processing Society for Materials, Environment & Energy
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top