抄録
Sb powder is added to Sn-Ag-Cu solder so that the fusing point of the solder increases. The solder powder is expected to apply at essentially the same temperature as the process temperature for the base solder, and to improve thermal fatigue property of the solder joining area. We report Differential Thermal Analysis, Vickers hardness and the tensile test result of 7.0% Sb powder added Sn-3Ag-0.5Cu solder and the result of thermal fatigue test of the solder with Scanning Acoustic Tomography. As the results of experiments, we concluded that Sb powder addition elevates the melting point of Sn-3Ag-0.5Cu solder, and that 7.0% Sb powder added Sn-3Ag-0.5Cu solder have good thermal fatigue reliability.
