High-temperature joining is a key technology for electronic component assembly and other high-temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a new joining technology for high-temperature applications. In this study, a feasibility study was conducted to determine whether chestnut-burr-like micro-sized Ag particles can be used for joint material, and the effect of joining conditions such as heating temperature, bonding pressure and joining atmosphere on the joint strength of the Cu-to-Cu joint was investigated. Joining using micro-sized Ag particles was successfully achieved under a nitrogen atmosphere and the joint that was bonded at 300°C for 600 s under a bonding pressure of 10 MPa showed high shear strength (～30 MPa).
