Deformation behavior of high-purity aluminum wiring ribbons during ultrasonic bonding was investigated using a laser-Doppler vibrometer, a high-speed laser displacement sensor, and a high-speed video camera. The displacement of the flat-bottom wedge tool was referred to as the index for the deformation of the ribbon. The deformation of the ribbon by applying the bonding force completes immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by ultrasonic vibration does not contain elastic component. Fine initial bond areas are first extended to the direction of the ultrasonic vibration and then they are expanded to the lateral direction. Finally, the bond areas coalesce with each other to form a continuous bond area.