銅系導電性接着剤の導電性発達挙動におけるバインダケミストリの影響
2016 年 5 巻 5 号 p. 300-308
詳細
2016 年 5 巻 5 号 p. 300-308
Curing behavior in air of epoxy-based electrically conductive adhesives composed of several types of amine-based curing agents containing copper micro-fillers was examined. Electrical conductivity was developed in these adhesives during gelation stage of the curing process. Electrical resistivity of the cured-adhesives varied depending on the amine-based curing agents. When a polyamide amine was used as the curing agent, relatively low electrical resistivity was obtained after curing. Although necking between copper fillers occurred in the epoxy-based binder during curing above 200 ℃, oxidation behavior of the fillers was quite different depending on the curing agents. Control of the interfacial reaction between copper fillers and chemical components of the binder is a key for development of air-curable adhesives containing copper fillers.
