抄録
In this study, the relation between thermal conductivity of underfill and thermal resistance of micro bump layer in threedimensional stacked ICs was investigated. Thermal analysis model of stacked ICs with local heat source was created and thermal transient simulation was carried out. Thermal structure function of the model was calculated and thermal resistance of micro bump layer was evaluated. As a result, it was found that increase in thermal conductivity of underfill up to 6 W/m・K caused a rapid decrease in thermal resistance of micro bump layer. On the other hand, when thermal conductivity of underfill was larger than that value, thermal resistance of micro bump layer was almost stable.
