脂肪族ポリアミン処理した銅フィラーを用いたフェノール系導電性接着剤の電気的信頼性に及ぼす硬化温度の影響

抄録

A phenolic-based electrically conductive adhesive containing copper fillers was prepared. The copper fillers were treated using tetraethylenepentamine（TEA）before mixing into the binder to suppress oxidation of the fillers. Although the adhesive exhibited lower electrical resistivity（50-100 μΩcm）after curing in air, variation in the resistivity during environmental tests was different depending on the curing temperature. When the adhesive was cured at 100℃, inter-filler conductive contacts and cross-linked polymer structure in the binder were not fully formed during curing. The electrical resistivity of the adhesive cured at 100℃ was varied during exposure to 85℃/85 %RH environment due to annealing effect and oxidation of the fillers. By contrast, the interfiller conductive contacts and cross-linked structure were sufficiently developed during curing at 150-200℃ to improve the electrical reliability. Therefore, curing condition is one of the important factors in determining the reliability of the adhesive.