抄録
Thermal sprayed coatings are made by multiple collisions of high speed molten drops.These processes give pores and voids to thermally sprayed coatings.Voids and pores influence heat conductivity,heat resistance and corrosion resistance of coatings.Therefore measuring porosity is important for obtain details of coatings.Electroplating technique has been tried to measure porosity of thermal spray coatings.But these techniques are not considered well from the aspect of electrochemistry.In this paper we evaluated structure of plasma sprayed ceramic coating using electroplating copper deposition.We optimized condition for electroplating which can fill copper in void and pores in thermally sprayed coatings and discussed about the condition from aspect of electrochemistry.
