抄録
The aerosol deposition (AD) method is a technique to achieve ceramic coating at room temperature. AD films are dense films composed of nanocrystals, and it is not clear how the large number of grain boundaries and small crystals affect their physical properties. This paper presents measurements of dielectric breakdown strength, nanoindentation hardness, and thermal conductivity of AD alumina films, which the authors have investigated for application to insulating heat-dissipating substrates. The AD alumina film exhibits excellent dielectric breakdown strength in the thickness range of 1-100 μm and thermal conductivity of 15-31 W m-1 K-1, which is almost the same as that of sintered materials, indicating that the AD film is promising as an insulating heat-dissipating substrates.
