抄録
A cause of fail circuit boards is mainly dominated by a defect of soldering. By leaving this defect, parts on the circuit board are destructed by over current or voltage. A detecting defect of a circuit board is necessary to prevent a circuit board from this destruction. A massed circuit board, however, make it difficult that a lot of parts on the circuit board are detected by a visual inspection. Today, various inspecting devices have been researched and developed using a visible CCD device. More high-precision and high-detecting capability, furthermore, are required for an inspecting devices.
In this study, a new method for a detecting defect has been attractively attempted using a infrared thermography camera. A soldering side of circuit board which was cooled from a behind parts side of the board by cooling board was observed using a thermography camera. From a thermal image which has a different of temperature transition depend on sold-mass, a detection can be achieved whether a mass of sold is optimum or not.
