簡便なプレーナマグネトロン形RFスパッタ装置
1981 年 24 巻 12 号 p. 648-652
詳細
1981 年 24 巻 12 号 p. 648-652
A simple design of a planar magnetron-type RF sputtering system is proposed in an attempt to obtain high deposition rate for relatively low RF power without any expensive components. The detailed design of a target assembly suitable for use in a conventional vacuum evaporation system is presented. The most desirable magnitude of the magnetic flux density in radial direction on the target surface is shown to be 600 to 800 gauss.
