真空部品用新銅電鋳法ならびに従来法との比較・評価

抄録

A new copper electroforming is compared with conventional electroformings which have been applied for vacuum components. The new copper electroforming characterized by the use of electrolyte which contains no organic additives and by periodic reverse electrolysis is called PR process.
The pure copper deposit obtained from the PR process shows better performance than the deposits by conventional processes for electrical resistivity (IACS), thermal stability and electrical break down at high vacuum.
And unlike the conventional processes, the PR process has excellent bath stability needed to keep deposit's quality constant. Also, the PR process is quite suitable for complex configuration components as the conventional pyrophosphate process.