Abstract
Aerosol Deposition is a promising process for fabrication of thick and dens ceramic coatings. Therefore, this process has been developed for fabrication of ceramic coatings especially lead zirconate titanate (PZT) coatings for Micro Electro Mechanical Systems (MEMS) devices. However, these devices require not only ceramic layer but also metal conductive layers. In this study, copper coating was fabricated by aerosol deposition process and evaluated the coating properties. Especially, the influence of process gas pressure was investigated. Average particle size of 1.5 μm of pure copper was deposited onto alumina substrate. The results show that increasing of process gas pressure increased both particle velocity and deposition efficiency. Furthermore, dense microstructure and lower electrical resistivity were obtained in the case of higher process gas pressure condition. However, excessive gas pressure caused peeling off the coatings due to residual stress in the coatings. The gas pressure for fabrication of copper coatings was optimized as 0.2 MPa in this study.
