This paper describes the microfabrication of titanium micro molds for the microfluidic chip by a reactive ion etching (RIE) system. The etching was carried out using SF6 plasma. We have examined the etching rate and surface roughness at the range of process pressure 0.3-0.7 Pa and RF (13.56 MHz radio-frequency) power 30-70 W. The etching rate is over 0.3 μm/min at the RF power of 70 W. The surface roughness of etched substrates is below 40 nm at the process pressure of 0.3 Pa. We made a titanium micro mold and molded microfluidic chips by using polycarbonate, and microresico® (Polypropylene resin).
