Development of Miniature Sputtering Deposition Equipment for Minimal Fab with HiPIMS Operations

Abstract

　Minimal fab is a new manufacturing system to suitably fabricate small numbers of semiconductor devices with very low investment. Minimal fab handles a half-inch wafer, and requires that the process equipment is installed in a small regulated chassis. For the minimal fab, sputter deposition equipment was developed. High power impulse magnetron sputtering (HiPIMS) technology was used for the deposition. The HiPIMS equipment for minimal fab successfully deposit conductive Al films for MOSFET devices. The equipment hardly generated particles that contaminated the fabricated devices. The electrical resistivity of deposited film was 45 nΩm. This resistivity was small enough to work the devices.