セラミックスと金属の接合部の信頼性評価 : 第1報,異材接合界面部の熱弾塑性応力に関する考察

抄録

Development of reliable bonding techniques for ceramics and metals is considered very important for more useful applications of ceramics. Generally, however, it is a serious problem that ceramics have a high thermal stress concentration at the bonded interface, caused by different thermal properties of both materials. The authors have been investigating various methods for effectively decreasing the stress concentration. In this paper, they present a fundamental consideration on the thermal stress distribution characteristics to the interface of dissimilar material joint, by using thermoelastic-plastic finite element analysis. Through this analysis, it is found that the high thermal stress is induced only in very narrow region, and that the value of the high stress is approximately estimated by a simplified theoretical analysis.