SMT端子の強度評価に関する研究

抄録

This paper describes the strength evaluation of surface mount solder joints. Recently Surface Mount Technology (SMT) has advanced with high density assembly of circuit. However, the reliability of surface mount solder joints may be lower than that of through-mount solder joints. So, the strength evaluation of surface mount solder joints is required. In this study, tensile tests for various specimens of butt-leaded surface mount solder joints have been conducted at first. Secondly, two-dimensional elastic-plastic analyses of the joints have been carried out by finite element method. From these results, the relation between the geometry and the strength of butt-leaded surface mount solder joints has been obtained.