抄録
Fundamental equations based on the linear-thermoviscoelastic theory were established to obtain the temperature and residual stress by cooling in a 3-layer laminated beam. The transient thermal stress and deformation in the laminated beam made of composite materials constructed LSI plastic packages were calculated using these fundamental equations. It was found that the residual stress is strongly related to glass transition temperature and Young's modulus of epoxy resins, and the material design method necessary in order to decrease the residual stress was clarified.
