微小円孔を有する電着銅薄膜による二軸応力検出法 : 第3報,二軸引張りとなる応力集中部への適用

抄録

Although the copper electroplating method of stress analysis can only detect the shearing stress amplitude, microcircular holes made in electrodeposited copper foil enable separation and measurement of the first and second princical stresses with biaxial stress conditions of a negative biaxial stress ratio. In this paper, developing the above idea, a method of detecting both principal stresses at the stress-concentrated location with a positive biaxial stress ratio is presented. The accuracy of this method is ascertained by examining the stress state near the hole in a plate under uniaxial tension and that at the bottom of a chircular groove in a shaft under bending.