Measuring elastic properties of thin film on substrates is important in the analysis of residual stresses of advanced 3D LSI. In this study, an approach to for nondestructive measurement of the elastic properties of thin film on the substrate nondestructively with a scanning acoustic microscope is proposed. The approach was analyzed mathematically and was applied to aluminum film on glass substrates. As a result, this approach was proved to be excellent for the objective, and the elastic modulus of aluminum film on the glass substrate was 10% smaller than that of the bulk data.
