電着銅薄膜による接触面圧計測法 : 第1報,基礎実験

抄録

Pulsating compression tests are performed in order to investigate the possibility of applying the copper electroplating method of stress analysis to measure the contact pressure between two bodies. Namely, the relation among density change of grown grains in copper foil inserted between contact surfaces, the magnitude of cyclic pressure σ_p and the number of cycles are examined by computer image processing, and can be expressed by a rate process equation. On the basis of this equation or the relation between σ_p and grown grain density at the given number of cycles, contact pressure and its distribution can be evaluated by observing the density or density change of grown grain.