円孔を有する電着銅薄膜による成長粒子の分布形状を利用した二軸応力検出法

抄録

In order to measure cyclic biaxial stresses by an electrodeposited copper foil with microcircular holes, both occurrence rate of slip bands at the periphery of microcircular holes and the grown grain occurrence rate in copper foil itself have been used. However, this method needs a great many microcircular holes to obtain high accuracy. So, in this report the different method from that ever used is examined. Namely, as the biaxial stress ratio affects the stress distribution of the periphery of circular hole in a plate, it is also expected that the distributed shape of grown grains at the periphery of circular hole in a copper foil is different with biaxial stress ratio. From this viewpoint, the length of the circumferential direction and radial direction of grown grains appeared are measured under various biaxial stresses, and the basic equations are proposed to obtain principal stress.