成膜後基板焼入れ処理によるTiN薄膜の密着強度改善メカニズム

抄録

In our previous studies, it was revealed that the adhesive strength of TiN film deposited on the steel substrate was drastically improved by the substrate quenching after TiN coating. In order to investigate the mechanisms of the improvement of the adhesive strength by such the substrate post quenching, the depth profile of atomic concentrations near the interface between TiN film and the steel substrate was investigated by rf glow discharge optical emission spectrometry (rf-GDOES). It was confirmed that the atomic diffusion at the interface was promoted and the thickness of the diffusion layer increased by the substrate post quenching. A good correlation was recognized between the variation of the adhesive strength with increasing the heating time in the substrate post quenching and the variation of the thickness of the diffusion layer. From these results, it was concluded that the main reason why the adhesive strength was improved was the increase of the thickness of the diffusion layer in the heating process of the substrate post quenching.