In the present study, quench tests were carried out to characterize the fracture behavior of advanced pore-free SiC with damage tolerance during thermal shock. The residual strength of specimens after the quench tests was also measured. It is found that the critical temperature difference and the decrease in residual strength of this material are larger than those of conventional SiC. This is because the fracture is dominated only by flaw size since the wake zone is not generated during thermal shock with high strain rate. The critical temperature difference as well as the crack propagation is calculated with the aid of the unified theory of thermal shock.
