熱硬化性樹脂と鋼材からなる粘弾性積層はりの反り変形過程における硬化収縮ひずみの解析

抄録

Epoxy resin used for electronic parts is transformed from the liquid to the solid by the chemical curing reaction, in this case, the residual stresses and the residual strains are caused in epoxy resin. Then, electronic parts become defective due to these stresses and strains. In this report, the strains caused by the chemical curing reaction and thermal load for laminated beam consisting of epoxy resin and steel were examined from both sides of experiment and theory. As a result, it was clarified that the strains generated in the laminated beam could be indicated by the sum of the bending strain caused by warp deformation and the compressive strain caused by the shrinkage of epoxy resin, and that the contribution ratio of each strain and the simple predicting equation based on theory in common use were proposed.