金属接触部における熱抵抗と電気抵抗の温度依存性

抄録

Temperature dependence of thermal and electrical contact resistance of copper has been investigated from 20 °C to 300 °C, experimentally. The real contact area increases as the temperature rises even if under the softening temperature, and the contact surfaces stick to each other due to the process of diffused junction at higher than softening temperature. The ratio of real contact area to apparent contact area and mean plane separation between two flat surfaces can be estimated using simple model of thermal and electrical contact resistance, where the ratio of 3.8×10^-6 and mean plane separation of 0.31 μm at 155 °C are obtained. Moreover, the thermal resistance of point contact's samples excluded the effect of apparent contact area as much as possible is also evaluated. The thermal resistance of point contact's samples is one digit or higher than that of two flat surfaces at the same electrical resistance, and the ratio of real contact area to apparent contact area is almost the same as that of the samples with various shapes.