放熱フィン一体形プラスチックLSIパッケージの熱設計

抄録

As a result of recent progress in electronic equipment and devices, the power dissipation of LSI chips has tended to increase Because of this trend, it has become more important to improve the heat transfer characteristic of LSI packages. Methods already used to enhance heat transfer in manufactured packages involve adding a heat spreader or using heat radiation leadframes. In this paper, we propose two kinds of thermally improved packaging designs. One has molded plastic fins on top of the surface. The other has leadframe fins that extend from the heat radiation leadframes. We designed these thermal structures using a previously reported thermal resistance analysis of LSI packages, and then built trial models. We measured the thermal resistance of these models suspended in a wind tunnel. According to the measurements, thermal resistance of the package with plastic fins is about 34% lower than that of a finless package, and resistance of the package with leadframe fins is about 20% lower than that of a package with only radiation leads.