抄録
Critical heat flux enhancement by the electrohydrodynamic (EHD) effect has been analyzed quantitatively based on the increased frequency of liquid-vapor interface oscillations around the edge of the bubble. The majority of heat transfer occurs when the liquid film thickness becomes less than 50 μm, which only occurs once per period. The main mechanism of heat flux enhancement induced by the EHD effect would be a result of an increase in surface tension due to the effect of electric lines of force. By representing the terms of the forces for a change in curvature and the surface tension resulting from the electric lines of force, the equation of the liquid-vapor instability was obtained and analyzed. Experimentally it has been shown that as the applied voltage increased, the periodic time interval of the thickness change was shortened. This effect reduces the potential for dryout of the liquid film by making the minimum thickness time period shorter. By measuring the pressure oscillation on the boiling surface, the change of the thin liquid film thickness and the dynamic shape of bubbles, the relationship among the pressure, the liquid film thickness and the bubble shape was clarified. Consequently, this model successfully explains the relationship between the applied voltage and the enhancement of the critical heat flux.
