2011 年 77 巻 780 号 p. 3025-3035
In this study, a method using optical contactless displacement sensors to evaluate vibrational stress was proposed. As sensors, light-emitting diodes were used. The values measured with multiple displacement sensors were used in the proposed method to approximately calculate deformation shape, that is, curvature radius which occurs within a relatively narrow area of anything to be measured, and then the vibrational stress was obtained using the curvature radius. The vibrational stress was compared with the stress obtained by the conventional method using strain gauges, and the applicability of the proposed method was verified. Furthermore, the measurement accuracy was discussed from a sensitivity analysis with regard to the signal-to-noise ratio during the measurements.