2013 年 79 巻 808 号 p. 4564-4571
Close-packed structures of fine particles can be self-assembled along specified path by dispensing suspension that contains particles on a substrate and drying it. By using imprinting process, the assembled particles can be transferred to another substrate coated with resin while keeping same edge height of the particles. This study aims to make clear the factors affecting on the assembly width of such patterning process in which spreading and shrinkage of the suspension fluctuates the width and location, including the subsequent replication process. Based on experiments and model analysis, the appropriate conditions were made clear for these processes. Then, the transferred structure was applied to polishing tool as trial where silica particles of 1 μm diameter were assembled along spiral pattern and then transferred on a glass plate using phenolic resin. The tool was pressed against another glass plate while applying rotational motion to carry out machining test. Smooth grooves were obtained on the workpiece though uniform or even engagement was not accomplished.