振動マルチワイヤソーに関する研究 : 第2報,振動の効果と加工精度

抄録

In the previous report, a method of vibration multiwire sawing was devised as a technology utilizing mechanical vibration energy to slice hard and brittle materials such as various ceramics. The results showed that the vibrational machining efficiency was two times the nonvibrational machining efficiency. In this report, the efficiency was two times the nonvibrational machining efficiency. In this report, the effect of applying vibrations are considered by means of theoretical analysis and experimentation, and the cutting accuracy of a wafer is examined. The findings are as follows : (1) When the amplitude exceeds 0.42 mm, the effective working load is increased. (2) The machining efficiency increases with an increase in slurry concentration. (3) The machining efficiency is in proportion to the wire running speed. (4) When the amplitude is 0.42∼0.75 mm, the effect of effective grains entering into the processing part increases. (5) When the frequency is 0∼30 Hz, the machining efficiency increases rapidly with an increase in frequency. (6) The thickness of the wafer decreases a little with an increase in amplitude, and the amount of scatter is decreased. (7) The affected layer of the wafer possesses the same volume in both nonvibration and vibration cutting.