シリコンウエハスライサのたわみ制御に関する研究

抄録

Deformation control of a silicon-wafer slicer cutting a crystal ingot is studied analytically. The thin rotating blade is clamped at the outer boundary and prestressed in the radial direction, while the inner periphery is subjected to stationary, distributed in-plane and lateral slicing loads from the workpiece. The deflection of the blade is obtained analytically by introducing the multi-model expansion method, further applying the Galerkin method to the governing equations of the system. Numerical results are presented for an actual SUS 301 blade cutting a 6"-diameter silicon ingot at a speed of 1550 rpm. Two control schemes that maintain the flatness of the rotating blade are examined in detail. In the first scheme, a pair of concentrated lateral forces are applied to the blade to reduce the blade deflection. In the second scheme, a pair of moments are also applied to the blade to improve the flatness of blade. Simulation results obtained show that the application of control moment is more effective than the simple lateral forces to the improvement of flatness of the slicing blade.