抄録
This paper deals with the wear of a diamond blade and the chipping of groove edges that cause penalty in the productivity on silicon wafer dicing. In this study, the dicing force is taken into consideration to understand the mechanism of dicing. A measuring system of the dicing force is developed and the mechanism of dicing is investigated at first. It is confirmed that the dicing Processes are more concerned with the material removed by the both sides of a blade in comparison with the conventional grinding. A method to estimate the dicing force quantitatively is proposed by applying the relationship between the specific dicing force and equivalent grinding chip thickness whcih is represented by an exponential equation. Relationships among the dicing force, the wafer chipping and the blade wear are also investigated. It is cofirmed that the wafer chipping and rate of blade wear increase as the dicing force increases.
