日本機械学会論文集 C編
Online ISSN : 1884-8354
Print ISSN : 0387-5024
プリント基板の小径ドリル加工に関する研究 : 超硬ドリルとダイヤモンドコートドリルの比較
青山 栄一廣垣 俊樹井上 久弘奥野 泰和矢村 剛一野辺 弘道片山 傳生
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2000 年 66 巻 644 号 p. 1355-1361

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It has been required that the packaging density of PWB(Printed Wiring Boad)is improved because high packaging density technology has allowed downsizing. Therefore, high-quality micromachinings are necessary for PWB. Especially, it is necessary that a great number of through-holes have to be drilled with high reliability to make a circuit. So it is required to improve the quality of the drilled hole. However, it is inevitabole that the quality of the drilled hole is varied owing to the wear of the cutting edge in a great number of drilling. In this paper, it is shown that the shape of the cutting edge is related to the damages around the drilled hole. And the internal damage, the surface roughness and the smear of the drilled hole are increased, as the number of drilled hole is increased. Additionally, it is cleared how the variation of edge shape due to diamond coating affects the drilled hole quality.

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