アルカリ粉末を添加したシリカ砥粒研磨パッドの加工安定性の向上

アルカリ粉末のコーティング処理

抄録

In order to increase removal rate of a silicon wafer, a new fixed-silica pad containing alkaline powders has been developed. But there are some problems to be solved, such as, adding alkaline powders deteriorates mechanical properties and uniformity of the pad and removal rate decreases with time. Moreover it is difficult to manufacture such pad after adding alkaline powders. Therefore, the coating processes of alkaline powders utilizing various coating agents were carried out. As a result, alkaline powders coated by polystyrene polymer were the most effective to solve, but coupling agent made more tough coating film by reaction with polyurethane polymer as matrix material of the pad. After coating process of KOH powders with titanate coupling agent, removal rate could become constant for a long time with better polished surface also. Instead of KOH powders, manufacturing of the pad with piperazine powders as an organic alkaline became possible by coating of the powders.