親水性キャリア粒子を用いた複合粒子研磨法に関する研究(機械要素,潤滑,設計,生産加工,生産システムなど)

抄録

The four-body polishing in which polymer particles are applied as a carrier of abrasives solved many problems of conventional polishing but some problems remained such as bubbling phenomenon and time-dependent deterioration of removal rate. In order to solve these problems, we advanced some experiments by employing some hydrophilic polymers and inorganic particles as the carrier particle. As a result, a hydrophilic polystyrene particle which was given a hydrophilic group on the surface accomplished better removal rate than untreated polystyrene particle. The bubbling problem was relieved completely by application of amorphous calcium phosphate particle. Though the removal rate decreased by employing some kind of porous inorganic particles, a distinguished surface roughness and edge geometry was obtained. Meanwhile, the removal rate was improved compared to the conventional polishing by using a molten-silica and an aggregated-silica particle. There are two maximum removal rates when the concentration of the silica particle was regulated. Furthermore, an exceptional removal rate was attained by optimizing the concentration of molten silica particles and changing the polishing conditions.