2006 Volume 63 Issue 9 Pages 561-576
Photosensitive polyimides (PSPIs) and polybenzoxazoles (PSPBOs) have been attracting great attention as insulating materials or protecting packages in microelectronics industries because they can be directly patterned by the action of UV irradiation. The photolithographic method of PI and PBO is advantageous due to simplified process steps as well as their outstanding properties. This article reviews developments of PSPIs and PSPBOs produced by a lot of researchers up to date. After brief introductions are given on PI and PBO, a typical patterning process out of photosensitive polymers in respect of both negative- and positive-working is described, Next details on each resist system involving PSPI and PSPBO are reviewed. Especially, what and how to form the patterns under UV exposure and heat treatment is the core subject of this review article. Each of their chemical processes can be understood in various ways.
