抄録
An efficient, compact water-cooled heat sink has been developed for high-power edge-pumped microchip lasers. A vertical, water jet impingement cooling system can reduce the heat sink cross-sectional area to Ο10 mm. Experimental results and theoretical analysis show dramatic enhancement of the heat transfer rate by a microchannel structure on the water-impinged, behind the heat sink top where laser material is bonded. Thermal resistance of 0.25°C/W was achieved in the central Ο5mm area of the heat sink's cooling surface. Continuous-wave (CW) laser output over 300W was successfully obtained from the diode edge-pumped, Yb: YAG microchip core (Ο5 mm area 0.3mm thick) bonded on the new heat sink.
