抄録
For the selective laser sintering of resin and metal powders in the same bath, we developed a laser
process that uses low melting point metal powders on such low heat resistant substrates as PEN, PET.
As a low melting point metal, we chose SnBi alloys, which have a eutectic point at 139˚C with a wide
composition range. For this study, the laser was irradiated from the back of the transparent substrate so
that the metal sintering proceeded from the interface between the powder layer and the substrate, which
does not require any surface flatness of the powders. Laser sintering using mixtures with different ratios
of Ag and Sn72Bi28 powders showed that the sintered line had the lowest resistance when 25 wt% of SnBi
was added. 1 min exposure of the line in the CuSO4 solution decreased the resistance by a two-digit
order due to the exchange of Sn with Cu through a galvanic replacement reaction.
