抄録
Ultrahigh-speed integrated-circuit technology is one of the key technologies for achieving ultralarge-capacity optical communication systems. Technological breakthroughs in circuit and packaging design as well as improved transistor performance are needed to reach the over-40-Gbit/s operating region. This paper describes InP-based device, high-speed circuit, and broadband packaging technologies developedto boost the speed of lightwave communication ICs. By using these technologies, we could make 40-Gbit/s lightwave communication ICs. Future prospects and a number of other related technological issues are also addressed.
