MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Influence of Deformation Temperature on Microstructure Evolution and Static Recrystallization of Polycrystalline Copper
Agnieszka Marta Wusatowska-SarnekHiromi MiuraTaku Sakai
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2001 Volume 42 Issue 11 Pages 2452-2459

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Abstract

Static recrystallization was studied in warm and hot deformed polycrystalline copper (99.99%). Samples were compressed to a strain of 0.25 at 573 K and 723 K at a strain rate of 2×10−1 s−1, quenched in water, and subsequently isothermally annealed at 673 K . Static recrystallization kinetics were found to be faster in samples hot-deformed at 723 K in spite of the lower level of stored strain energy. In all cases nucleation at the early stages of annealing takes place by bulging of serrated grain boundaries. Deformation at 723 K introduces higher orientation gradients evolved along serrated grain boundaries than those at 573 K . It is shown that static recrystallization is controlled not only by the level of stored strain energy, but also by the specific features of sub-grain structures formed in local regions.

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© 2001 The Japan Institute of Metals and Materials
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