MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Improvement of Ta Barrier Film Properties in Cu Interconnection by Using a Non-mass Separated Ion Beam Deposition Method
Jae-Won LimYukio IshikawaKiyoshi MiyakeMutsuo YamashitaMinoru Isshiki
Author information
JOURNALS FREE ACCESS

2002 Volume 43 Issue 3 Pages 478-481

Details
Abstract

Ta/Si (100) and Cu/Ta/Si (100) film structures were fabricated by using ion beam deposition with a modified RF sputter-type ion source, in which a strong RF discharge was introduced in order to enhance the plasma density. For Ta/Si structures, Ta films were deposited at various bias voltages. When the substrate bias voltage was not applied, the Ta film showed a columnar structure and had a high resistivity of 2600 nΩm. On the other hand, when the substrate bias voltage of −50–−200 V was applied, the cross-sectional observation did not show columnar structure at all. In this case, film deposition was considered to be sufficient migration energy by the accelerated Ta+ ions. In particular, Ta films deposited at a bias voltage of −125 V had a very small resistivity of 360 nΩm. Thermal stability of Cu(100 nm)/Ta(50 nm)/Si films, where Ta plays a role of diffusion barrier, was evaluated after annealing in H2 atmosphere for 60 min at various temperatures. Non-columnar structure Ta films deposited at substrate bias voltages of −50 V and −125 V were found to be stable up to 600°C, while columnar structure Ta films deposited at zero bias voltage degraded at 300°C. This result indicates that the thermal stability of the Ta films is mainly governed by the film microstructure of the deposited layer.

Information related to the author
© 2002 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top