MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Interdiffusion in α Solid Solution of the Al-Cu-Mg-Ag System
Tomoshi TakahashiKoji HisayukiToshimi YamaneYoritoshi MinaminoTakanori Hino
Author information
JOURNAL FREE ACCESS

2003 Volume 44 Issue 11 Pages 2252-2257

Details
Abstract
Quaternary and ternary interdiffusion experiments of Al-rich α Al-Cu-Mg-Ag alloys have been performed in the temperature range from 793 to 853 K. The concentration profiles indicate that the diffusion distance of Cu is shorter than those of Mg and Ag in the solid solutions. The direct and indirect interdiffusion coefficients are positive in the ternary and quaternary alloys. The ratio of indirect coefficient to direct one suggests that repulsive interactions exist between Cu and Mg atoms in the Al-Cu-Mg-Ag alloys. In addition, the ratio values of converted interdiffusion coefficients in the quaternary alloys suggest that the interactions between Al(solvent) and Cu atoms are attractive in the present alloy.
Content from these authors
© 2003 The Japan Institute of Metals and Materials
Previous article Next article
feedback
Top