MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Effect of Sn Addition on the Mechanical and Electrical Properties of Cu-15%Cr In-Situ Composites
Shigeki SkaiHirowo G. SuzukiKuniteru MiharaJusheng Ma
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2003 Volume 44 Issue 2 Pages 232-238

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Abstract

Effect of Sn addition on the mechanical and electrical properties of Cu–15%Cr in-situ composites has been studied. The addition of 0.1%Sn is effective for the solid solution hardening. Accumulation of high density of dislocations and development of banding structure by cold drawing give the increment of tensile strength. The precipitation of Cr in cupper matrix was accelerated and distinct secondary hardening occurs after cold rolling and aging treatment. It was found that the tensile strength of 1100 MPa with electrical conductivity of 70%IACS were attained in the Cu–15%Cr–0.1%Sn by the optimization of thermomechanical processing.

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© 2003 The Japan Institute of Metals and Materials
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