抄録
The transient liquid phase (TLP) bonding process of Ni using a Ni–11 mass%P binary filler metal was simulated by using both a phase-field model (PFM) and a moving boundary model (MBM). The dissolution of the base metal and isothermal solidification behavior during the TLP bonding process were simulated, and the results calculated by using the PFM were compared with those obtained by using the MBM. The results obtained during the isothermal solidification process in the two models were the same. The change in the concentration at the solid-liquid interface during the dissolution of the base metal was examined, and deviation from the local equilibrium concentration occurred in samples with a high heating rate in the phase-field simulation. On the other hand, the local equilibrium was always maintained in the MBM, but the calculation time of the simulation using the MBM was several hundred-times faster than that using the PFM.
