Novel Ultrasonic Soldering Technique for Lead-Free Solders

Abstract

Sn-Bi alloy is one of the representative low temperature type lead-free solders. However, the bonding properties of the Sn-Bi solder are not good. The reason for such properties is related to Bi microcrystallines that segregate at the interface between the solder and a Cu substrate. We found that ultrasound improves the bonding strength for the Sn-Bi alloy system solders by dispersing and miniaturizing the Bi crystals. To achieve such dispersion, we invented a novel ultrasonic soldering technique. By using this technique, ultrasound can be applied to printed wiring boards (PWB). Besides the improved bonding strength, we found that the temperature of a PWB is increased by the application of ultrasound to the PWB. Sn-58 mass%Bi solder is melted by the vibrational energy of ultrasound without other heating methods. Moreover, the interfacial layer between the Sn-58Bi solder and the Cu land is homogenized by ultrasound. Also, the interfacial layer between the Sn-8Zn-3Bi solder and a Cu land becomes thinner by ultrasound. We believe that these changes in the interfacial structure improve the mechanical properties of the solders. Therefore, ultrasonic soldering technique will improve the usability and reliability of Sn-Bi alloy system solders.