MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface
Jong Hoon KimSang Won JeongHyuck Mo Lee
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2004 Volume 45 Issue 3 Pages 710-713

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Abstract

By the reaction of molten solder alloy with compositions of 96.5Sn-3.5Ag (compositions are all in weight percent unless specified otherwise) with either the thick Cu or the thick Ni substrate at 250°C, the rounded Cu6Sn5 grains formed over Cu and the faceted Ni3Sn4 grains precipitated over Ni. As the soldering time changed from 1 min to 60 min, normal grain growth occurred for rounded Cu6Sn5 grains while abnormal grain growth (AGG) mode was observed for faceted Ni3Sn4 grains. The measured grain size distributions also confirmed the difference between normal grain growth and abnormal grain growth.

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© 2004 The Japan Institute of Metals and Materials
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